semiconductor technical data 1 rev 7 ? motorola, inc. 1995 10/95
highperformance silicongate cmos the mc54/74hc04a is identical in pinout to the ls04 and the mc14069. the device inputs are compatible with standard cmos out - puts; with pullup resistors, they are compatible with lsttl outputs. the device consists of six threestage inverters. ? output drive capability: 10 lsttl loads ? outputs directly interface to cmos, nmos and ttl ? operating voltage range: 2 to 6v ? low input current: 1 m a ? high noise immunity characteristic of cmos devices ? in compliance with the jedec standard no. 7a requirements ? chip complexity: 36 fets or 9 equivalent gates logic diagram y1 a1 a2 a3 a4 a5 a6 y2 y3 y4 y5 y6 1 3 5 9 11 13 2 4 6 8 10 12 y = a pinout: 14lead packages (top view) 13 14 12 11 10 9 8 2 1 3 4 5 6 7 v cc a6 y6 a5 y5 a4 y4 a1 y1 a2 y2 a3 y3 gnd l h function table inputs outputs a h l y d suffix soic package case 751a03 n suffix plastic package case 64606 1 14 1 14 1 14 dt suffix tssop package case 948g01 j suffix ceramic package case 63208 1 14 ordering information mc54hcxxaj mc74hcxxan mc74hcxxad mc74hcxxadt ceramic plastic soic tssop
mc54/74hc04a motorola highspeed cmos logic data dl129 e rev 6 2 ??????????????????????? ??????????????????????? ??????????????????????? ??????????????????????? maximum ratings* ??? ??? ??? ??? symbol ?????????????? ?????????????? ?????????????? ?????????????? parameter ?????? ?????? ?????? ?????? value ??? ??? ??? ??? unit ??? ??? ??? ??? v cc ?????????????? ?????????????? ?????????????? ?????????????? dc supply voltage (referenced to gnd) ?????? ?????? ?????? ?????? 0.5 to + 7.0 ??? ??? ??? ??? v ??? ??? ??? ??? v in ?????????????? ?????????????? ?????????????? ?????????????? dc input voltage (referenced to gnd) ?????? ?????? ?????? ?????? 0.5 to v cc + 0.5 ??? ??? ??? ??? v ??? ??? ??? ??? v out ?????????????? ?????????????? ?????????????? ?????????????? dc output voltage (referenced to gnd) ?????? ?????? ?????? ?????? 0.5 to v cc + 0.5 ??? ??? ??? ??? v ??? ??? ??? ??? i in ?????????????? ?????????????? ?????????????? ?????????????? dc input current, per pin ?????? ?????? ?????? ?????? 20 ??? ??? ??? ??? ma ??? ??? ??? ??? i out ?????????????? ?????????????? ?????????????? ?????????????? dc output current, per pin ?????? ?????? ?????? ?????? 25 ??? ??? ??? ??? ma ??? ??? ??? ??? i cc ?????????????? ?????????????? ?????????????? ?????????????? dc supply current, v cc and gnd pins ?????? ?????? ?????? ?????? 50 ??? ??? ??? ??? ma ??? ??? ??? ??? ??? p d ?????????????? ?????????????? ?????????????? ?????????????? ?????????????? power dissipation in still air, plastic or ceramic dip2 soic package2 tssop package2 ?????? ?????? ?????? ?????? ?????? 750 500 450 ??? ??? ??? ??? ??? mw ??? ??? ??? ??? t stg ?????????????? ?????????????? ?????????????? ?????????????? storage temperature ?????? ?????? ?????? ?????? 65 to + 150 ??? ??? ??? ??? c ??? ??? ??? ??? ??? ??? t l ?????????????? ?????????????? ?????????????? ?????????????? ?????????????? ?????????????? lead t emperature, 1 mm from case for 10 seconds plastic dip, soic or tssop package ceramic dip ?????? ?????? ?????? ?????? ?????? ?????? 260 300 ??? ??? ??? ??? ??? ??? c * maximum ratings are those values beyond which damage to the device may occur . functional operation should be restricted to the recommended operating conditions. 2derating e plastic dip: 10 mw/ c from 65 to 125 c ceramic dip: 10 mw/ c from 100 to 125 c soic package: 7 mw/ c from 65 to 125 c tssop package: 6.1 mw/ c from 65 to 125 c for high frequency or heavy load considerations, see chapter 2 of the motorola highspeed cmos data book (dl129/d). recommended operating conditions ???? ???? ???? ???? symbol ?????????????? ?????????????? ?????????????? ?????????????? parameter ??? ??? ??? ??? min ??? ??? ??? ??? max ??? ??? ??? ??? unit ???? ???? ???? ???? v cc ?????????????? ?????????????? ?????????????? ?????????????? dc supply voltage (referenced to gnd) ??? ??? ??? ??? 2.0 ??? ??? ??? ??? 6.0 ??? ??? ??? ??? v ???? ???? ???? ???? v in , v out ?????????????? ?????????????? ?????????????? ?????????????? dc input voltage, output voltage (referenced to gnd) ??? ??? ??? ??? 0 ??? ??? ??? ??? v cc ??? ??? ??? ??? v ???? ???? ???? ???? t a ?????????????? ?????????????? ?????????????? ?????????????? operating temperature, all package types ??? ??? ??? ??? 55 ??? ??? ??? ??? + 125 ??? ??? ??? ??? c ???? ???? ???? ???? ???? ???? t r , t f ?????????????? ?????????????? ?????????????? ?????????????? ?????????????? ?????????????? input rise and fall time v cc = 2.0 v (figure 1) v cc = 4.5 v v cc = 6.0 v ??? ??? ??? ??? ??? ??? 0 0 0 ??? ??? ??? ??? ??? ??? 1000 500 400 ??? ??? ??? ??? ??? ??? ns this device contains protection circuitry to guard against damage due to high static voltages or electric fields. however , precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this highimpedance cir - cuit. for proper operation, v in and v out should be constrained to the range gnd (v in or v out ) v cc . unused inputs must always be tied to an appropriate logic voltage level (e.g., either gnd or v cc ). unused outputs must be left open.
mc54/74hc04a highspeed cmos logic data dl129 e rev 6 3 motorola dc characteristics (voltages referenced to gnd) v cc v guaranteed limit symbol parameter condition v cc v 55 to 25 c 85 c 125 c unit v ih minimum highlevel input voltage v out = 0.1v or v cc 0.1v |i out | 20 m a 2.0 3.0 4.5 6.0 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 v v il maximum lowlevel input voltage v out = 0.1v or v cc 0.1v |i out | 20 m a 2.0 3.0 4.5 6.0 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 v v oh minimum highlevel output voltage v in = v ih or v il |i out | 20 m a 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 v v in =v ih or v il |i out | 2.4ma |i out | 4.0ma |i out | 5.2ma 3.0 4.5 6.0 2.48 3.98 5.48 2.34 3.84 5.34 2.20 3.70 5.20 v ol maximum lowlevel output voltage v in = v ih or v il |i out | 20 m a 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih or v il |i out | 2.4ma |i out | 4.0ma |i out | 5.2ma 3.0 4.5 6.0 0.26 0.26 0.26 0.33 0.33 0.33 0.40 0.40 0.40 i in maximum input leakage current v in = v cc or gnd 6.0 0.1 1.0 1.0 m a i cc maximum quiescent supply current (per package) v in = v cc or gnd i out = 0 m a 6.0 1.0 10 40 m a note: information on typical parametric values can be found in chapter 2 o f the motorola highspeed cmos data book (dl129/d). ac characteristics (c l = 50pf, input t r = t f = 6ns) v cc v guaranteed limit symbol parameter v cc v 55 to 25 c 85 c 125 c unit t plh , t phl maximum propagation delay, input a or b to output y (figures 1 and 2) 2.0 3.0 4.5 6.0 75 30 15 13 95 40 19 16 110 55 22 19 ns t tlh , t thl maximum output transition time, any output (figures 1 and 2) 2.0 3.0 4.5 6.0 75 27 15 13 95 32 19 16 110 36 22 19 ns c in maximum input capacitance 10 10 10 pf note: for propagation delays with loads other than 50 pf, and information on typical parametric values, see chapte r 2 o f the motorola high speed cmos data book (dl129/d). c pd power dissipation capacitance (per inverter)* typical @ 25 c, v cc = 5.0 v pf c pd power dissipation capacitance (per inverter)* 20 pf * used to determine the noload dynamic power consumption: p d = c pd v cc 2 f + i cc v cc . for load considerations, see chapter 2 of the motorola highspeed cmos data book (dl129/d).
mc54/74hc04a motorola highspeed cmos logic data dl129 e rev 6 4 figure 1. switching waveforms gnd v cc output y input a c l * *includes all probe and jig capacitance test point 90% 50% 10% t tlh device under test output figure 2. test circuit y a figure 3. expanded logic diagram (1/6 of the device shown) t thl 90% 50% 10% t plh t phl t f t r
mc54/74hc04a highspeed cmos logic data dl129 e rev 6 5 motorola outline dimensions j suffix ceramic dip package case 63208 issue y min min max max inches millimeters dim a b c d f g j k l m n 0.785 0.280 0.200 0.020 0.065 0.015 0.170 15 0.040 0.750 0.245 0.155 0.015 0.055 0.008 0.125 0 0.020 19.94 7.11 5.08 0.50 1.65 0.38 4.31 15 1.01 19.05 6.23 3.94 0.39 1.40 0.21 3.18 0 0.51 0.100 bsc 0.300 bsc 2.54 bsc 7.62 bsc notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimesnion f may narrow to 0.76 (0.030) where the lead enters the ceramic body. 14 8 1 7 -a- -b- -t- seating plane f g n k c l m 0.25 (0.010) t a m s 0.25 (0.010) t b m s j 14 pl d 14 pl n suffix plastic dip package case 64606 issue l notes: 1. leads within 0.13 (0.005) radius of true position at seating plane at maximum material condition. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 4. rounded corners optional. 1 7 14 8 b a f h g d k c n l j m seating plane dim min max min max millimeters inches a 0.715 0.770 18.16 19.56 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 f 0.040 0.070 1.02 1.78 g 0.100 bsc 2.54 bsc h 0.052 0.095 1.32 2.41 j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.300 bsc 7.62 bsc m 0 10 0 10 n 0.015 0.039 0.39 1.01
mc54/74hc04a motorola highspeed cmos logic data dl129 e rev 6 6 outline dimensions d suffix plastic soic package case 751a03 issue f min min max max millimeters inches dim a b c d f g j k m p r 8.55 3.80 1.35 0.35 0.40 0.19 0.10 0 5.80 0.25 8.75 4.00 1.75 0.49 1.25 0.25 0.25 7 6.20 0.50 0.337 0.150 0.054 0.014 0.016 0.008 0.004 0 0.228 0.010 0.344 0.157 0.068 0.019 0.049 0.009 0.009 7 0.244 0.019 1.27 bsc 0.050 bsc notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. a b p 7 pl g c k seating plane d 14 pl m j r x 45 1 7 8 14 0.25 (0.010) t b a m s s b 0.25 (0.010) m m f dt suffix plastic tssop package case 948g01 issue o dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l u seating plane 0.10 (0.004) t ??? ??? ??? ??? ??? section nn detail e j j1 k k1 detail e f m w 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t v 14x ref k n n
mc54/74hc04a highspeed cmos logic data dl129 e rev 6 7 motorola how to reach us: usa/europe : motorola literature distribution; japan : nippon motorola ltd.; tatsumispdjldc, toshikatsu otsuki, p.o. box 20912; phoenix, arizona 85036. 18004412447 6f seibubutsuryucenter, 3142 tatsumi kotoku, tokyo 135, japan. 0335218315 mfax : rmf ax0@email.sps.mot.com touchtone (602) 2446609 hong kong : motorola semiconductors h.k. ltd.; 8b tai ping industrial park, internet : http://designnet.com 51 ting kok road, tai po, n.t., hong kong. 85226629298 motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability , including without limitation consequential or incidental damages. at ypicalo parameters can and do vary in dif ferent applications. all operating parameters, including at ypicalso must be validated for each customer application by customer ' s technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or death may occur . should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/af firmative action employer . mc54/74hc04a/d
? codeline
|
